Invention Grant
- Patent Title: Electronic component mounting system and electronic component mounting method
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Application No.: US15267069Application Date: 2016-09-15
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Publication No.: US10212866B2Publication Date: 2019-02-19
- Inventor: Hiroaki Kurata
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2015-197269 20151005
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H05K13/02 ; H05K13/08

Abstract:
An electronic component system includes an electronic component mounting line mounting an electronic component on a board (exposure managing board) for which management of exposure time is necessary, a package ID reader (recognition unit) which recognizes a package code (identification information) that is applied to a package bag, and a storage unit which stores an exposure time limit which is permissible from an open time before reaching a management release in which management of the exposure time is unnecessary. In the electronic component mounting system, the package code is read while the package bag is open, the read time is stored as the open time, an expected duration is calculated which is necessary from a predetermined point of time before reaching the management release, and it is determined whether or not the exposure time limit is exceeded before the board which is exposed in the atmosphere reaches the management release.
Public/Granted literature
- US20170099751A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD Public/Granted day:2017-04-06
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