Invention Grant
- Patent Title: Non-contact vibration suppression device and object processing method
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Application No.: US15033988Application Date: 2014-11-04
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Publication No.: US10214439B2Publication Date: 2019-02-26
- Inventor: Shin Kim , Ki Nam Kim , Mun Hwan Seol , Dong Young Cho
- Applicant: Corning Precision Materials Co., Ltd.
- Applicant Address: KR
- Assignee: Corning Precision Materials Co., Ltd.
- Current Assignee: Corning Precision Materials Co., Ltd.
- Current Assignee Address: KR
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: KR10-2013-0133103 20131104
- International Application: PCT/KR2014/010481 WO 20141104
- International Announcement: WO2015/065147 WO 20150507
- Main IPC: C03B23/00
- IPC: C03B23/00 ; B65H23/188 ; B65H29/52 ; C03B33/023 ; B26D7/08 ; B26D7/22 ; B24B7/24 ; B24B41/06 ; B65H5/00 ; C03C17/00 ; B65H5/38 ; B65G49/06 ; C03B35/24

Abstract:
The present invention provides a non-contact vibration suppression device comprising a first ultrasonic vibration unit and a second ultrasonic vibration unit, the device being characterized in that the first ultrasonic vibration unit and the second ultrasonic vibration unit are installed to face each other while being spaced from each other such that an object can be interposed therebetween, the first ultrasonic vibration unit and the second ultrasonic vibration unit generate ultrasonic vibrations, respectively, and apply repulsive forces, which result from the ultrasonic vibrations, to the object such that the object is constrained with no contact between the first ultrasonic vibration unit and the second ultrasonic vibration unit, thereby suppressing vibration of the object. In addition, the present invention provides an object processing method characterized by comprising the steps of: suppressing vibration of the object using the non-contact vibration suppression device; and processing the object, vibration of which has been suppressed.
Public/Granted literature
- US20160304382A1 NON-CONTACT VIBRATION SUPPRESSION DEVICE AND OBJECT PROCESSING METHOD Public/Granted day:2016-10-20
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