- Patent Title: Copper nanoparticles and production method for same, copper nanoparticle fluid dispersion, copper nanoink, copper nanoparticle preservation method, and copper nanoparticle sintering method
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Application No.: US15120978Application Date: 2015-02-12
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Publication No.: US10214656B2Publication Date: 2019-02-26
- Inventor: Hideya Kawasaki , Ryuichi Arakawa , Yuki Hokita
- Applicant: A SCHOOL CORPORATION KANSAI UNIVERSITY
- Applicant Address: JP Osaka
- Assignee: A SCHOOL CORPORATION KANSAI UNIVERSITY
- Current Assignee: A SCHOOL CORPORATION KANSAI UNIVERSITY
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-037204 20140227
- International Application: PCT/JP2015/053833 WO 20150212
- International Announcement: WO2015/129466 WO 20150903
- Main IPC: B32B5/16
- IPC: B32B5/16 ; C09D11/52 ; B32B27/14 ; B22F9/24 ; B82Y30/00 ; B22F1/00 ; C09C1/62 ; C09D11/00 ; C09D17/00 ; B82Y40/00

Abstract:
An object of the present invention is to provide copper nanoparticles that suppress the oxidation of copper, have an average particle diameter of 10 nm or less and therefore undergo a remarkable reduction in the melting point, are highly dispersible, can be sintered at a low temperature, allow the removal of the protective layer during low-temperature sintering at 150° C. or less, and can be suitably used as a conductive copper nanoink material; and to also provide a method for preserving copper nanoparticles, whereby the copper nanoparticles can be stably preserved at room temperature for a long period of time, and can be transported.The present invention provides copper nanoparticles each having a central portion comprising a copper single crystal, and a protective layer surrounding the central portion; (1) the copper nanoparticles having an average particle diameter of 10 nm or less; (2) the protective layer containing at least one member selected from the group consisting of C3-6 primary alcohols, C3-6 secondary alcohols, and derivatives thereof; and (3) the protective layer having a boiling point or thermal decomposition point of 150° C. or less.
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