Invention Grant
- Patent Title: Composite epoxy resin board and forming method thereof
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Application No.: US15633709Application Date: 2017-06-26
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Publication No.: US10214920B2Publication Date: 2019-02-26
- Inventor: Dangji Song
- Applicant: GUANGDONG OUMING NEW MATERIAL TECHNOLOGY CO.,LTD
- Applicant Address: CN Yandong, Guangdong
- Assignee: GUANGDONG OUMING NEW MATERIAL TECHNOLOGY CO., LTD
- Current Assignee: GUANGDONG OUMING NEW MATERIAL TECHNOLOGY CO., LTD
- Current Assignee Address: CN Yandong, Guangdong
- Priority: CN201710008279 20170105
- Main IPC: E04F15/10
- IPC: E04F15/10 ; B32B27/08 ; B32B5/20 ; B32B27/38 ; B29C43/00 ; B29B17/04 ; E04F15/22 ; B32B5/18 ; B32B7/12 ; B32B9/00 ; B32B9/04 ; B32B21/08 ; B32B21/14 ; B32B25/08 ; B32B27/06 ; B32B27/10 ; B32B27/18 ; B32B27/30 ; B32B27/32 ; B32B27/40 ; B32B27/42 ; B32B29/06 ; B29K63/00 ; B29K105/26 ; B29L31/00 ; B29C43/24
Abstract:
A composite epoxy resin board, made from a raw material which includes the following weight percentage of components: waste prepreg powders of 5% to 100%, and waste printed circuit board (PCB) powders of 0% to 95%, is disclosed. The present invention adopts the waste prepregs as the main preparation raw material, which not only recycles and reuses prepreg scraps, but also reduces or even eliminates the use of adhesives due to the high epoxy resin content in the prepregs, while also reducing the glue-mixing time in the forming process, thereby simplifying the forming technology.
Public/Granted literature
- US20170298639A1 Composite Epoxy Resin Board and Forming Method Thereof Public/Granted day:2017-10-19
Information query
