Invention Grant
- Patent Title: Ejector using swirl flow
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Application No.: US15079776Application Date: 2016-03-24
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Publication No.: US10215196B2Publication Date: 2019-02-26
- Inventor: Young-min Cheong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2015-0142425 20151012
- Main IPC: F04F5/46
- IPC: F04F5/46 ; F04F5/20 ; F04F5/36 ; F04F5/42 ; F25B1/06 ; F25B43/00 ; F25B41/00

Abstract:
An ejector for a vapor compression system using a swirl flow includes an ejector body comprising a main inlet into which a main flow in high pressure flows, a nozzle section in fluid communication with the main inlet, a mixing portion in fluid communication with the nozzle section, a diffuser in fluid communication with the mixing portion, and a discharge portion in fluid communication with the diffuser. A suction pipe is inserted in a center of the ejector body and includes a through-hole into which a suction flow in low pressure flows and a leading end portion of an outer surface of the pipe forms a plurality of inclined passages with the nozzle section of the ejector body. These passages allow the main flow to be moved to the mixing portion so as to form a swirl flow between the main flow and suction flow when mixed in the ejector.
Public/Granted literature
- US20170102010A1 Ejector Using Swirl Flow Public/Granted day:2017-04-13
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