Invention Grant
- Patent Title: Circuits for and methods of implementing an inductor and a pattern ground shield in an integrated circuit
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Application No.: US15397612Application Date: 2017-01-03
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Publication No.: US10217703B2Publication Date: 2019-02-26
- Inventor: Parag Upadhyaya , Jing Jing
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent Kevin T. Cuenot
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L49/02 ; H01L21/768 ; H03B5/12 ; H01L23/64 ; H01L29/40
Abstract:
An integrated circuit device is described. The integrated circuit device comprises a substrate; a plurality of metal routing interconnect layers; an inductor formed in at least one metal layer of the plurality of metal routing interconnect layers; and a bottom metal layer between the plurality of metal routing interconnect layers and the substrate; wherein a pattern ground shield is formed in the bottom metal layer. A method of implementing an integrated circuit device is also disclosed.
Public/Granted literature
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