Invention Grant
- Patent Title: Composite substrate for antenna module and preparation method thereof
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Application No.: US15305413Application Date: 2016-08-30
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Publication No.: US10218064B2Publication Date: 2019-02-26
- Inventor: Yoon Ho Jung , Hyung Min Cho , Hyo Seung Jin , Eun Song Baik , Tae Geuk Lim
- Applicant: DOOSAN CORPORATION
- Applicant Address: KR Seoul
- Assignee: DOOSAN CORPORATION
- Current Assignee: DOOSAN CORPORATION
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2016-0087310 20160711
- International Application: PCT/KR2016/009611 WO 20160830
- International Announcement: WO2018/012668 WO 20180118
- Main IPC: H01Q7/06
- IPC: H01Q7/06 ; H01Q1/38 ; H05K1/09 ; H05K3/46 ; H05K1/03 ; H01F10/12 ; H01F10/08 ; H05K3/02 ; H05K9/00 ; H04B5/00

Abstract:
The present disclosure provides a composite substrate for an antenna module, which includes: a first non-magnetic substrate that is configured to have a first copper foil; a second non-magnetic substrate that is configured to have a second copper foil; and a magnetic sheet that is configured to be interposed between the first non-magnetic substrate and the second non-magnetic substrate and that is configured to be integrally laminated with the non-magnetic substrates, and further provides a preparation method thereof. The present disclosure provides a simplification of a process, low costs, a slim design, and a grip-feeling of a metal material while providing functions of wireless charging, MST, and NFC.
Public/Granted literature
- US20180205142A1 COMPOSITE SUBSTRATE FOR ANTENNA MODULE AND PREPARATION METHOD THEREOF Public/Granted day:2018-07-19
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