Invention Grant
- Patent Title: Loudspeaker module
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Application No.: US15571494Application Date: 2015-11-18
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Publication No.: US10219055B2Publication Date: 2019-02-26
- Inventor: Zhaopeng Li , Huawei Liu , Xueping Song , Zhilei Han
- Applicant: GOERTEK INC.
- Applicant Address: CN Weifang
- Assignee: GOERTEK INC.
- Current Assignee: GOERTEK INC.
- Current Assignee Address: CN Weifang
- Priority: CN201510227071 20150506
- International Application: PCT/CN2015/094898 WO 20151118
- International Announcement: WO2016/176981 WO 20161110
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R31/00

Abstract:
Disclosed is a loudspeaker module comprising a module housing, wherein a loudspeaker unit is accommodated in the module housing; the loudspeaker unit comprises a unit housing and a unit front cover; an end surface of a sidewall of at least one side of the unit housing is provided with an ultrasonic surface welded to the module housing by means of ultrasound; and an ultrasonic line bonded with the ultrasonic surface by means of ultrasound is provided at a position on the module housing corresponding to the ultrasonic surface. The loudspeaker module of the present invention solves the technical problems of a complex assembly process, poor sealing performance and poor appearance of the loudspeaker module in the prior art, and the loudspeaker module of the present invention has a simple assembly process, good sealing performance, high quality appearance, excellent acoustic performance, high production efficiency and low production cost.
Public/Granted literature
- US20180139522A1 LOUDSPEAKER MODULE Public/Granted day:2018-05-17
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