Invention Grant
- Patent Title: Electronics enclosure systems and methods
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Application No.: US15282314Application Date: 2016-09-30
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Publication No.: US10219398B2Publication Date: 2019-02-26
- Inventor: Andrew S. Cromarty , Jacob H. Neugass , Jasen Levoy
- Applicant: Heathkit Company, Inc.
- Applicant Address: US CA Santa Cruz
- Assignee: HEATHKIT COMPANY, INC.
- Current Assignee: HEATHKIT COMPANY, INC.
- Current Assignee Address: US CA Santa Cruz
- Agency: Squire Patton Boggs (US) LLP
- Main IPC: A47B96/04
- IPC: A47B96/04 ; H05K7/14 ; H05K5/00 ; H05K5/02
Abstract:
An enclosure assembly for electronic equipment using a housing and a sled. The sled is a combination of a bracket with a skid, the skid preferably of a low friction material, where the sled slides into the housing in order to complete the assembly.
Public/Granted literature
- US20170086339A1 ELECTRONICS ENCLOSURE SYSTEMS AND METHODS Public/Granted day:2017-03-23
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