The present application has disclosed a substrate grinding device, which includes a carrying platform, a lifting platform and a grinding head, the lifting platform is located above the carrying platform and configured to be movable in a direction perpendicular to an upper surface of the carrying platform with respect to the carrying platform upwardly or downwardly; and the grinding head is mounted to the lifting platform and configured to grind a grind region of a substrate to be ground disposed on the carrying platform, the grind region being a region of the substrate where there is a partial scratch.