A disc containing copper for sapphire polishing; the annular surface of the disc is provided with a spiral grinding groove or concentric circular grinding grooves thereon; and stepped grooves are provided at the edges along both the outer ring and inner ring of the annular surface of the disc. Also provided is a method of repairing discs containing copper facing each other for sapphire polishing, comprising: first step, horizontally and transversely moving an upper disc and a lower disc turning tool, or a lower disc and an upper disc turning tool, and aligning the turning tool with the original position of the grinding groove on the corresponding disc; second step, controlling the upper disc and the lower disc to rotate in opposite directions at the same rotation speed and with the turning tools fixed, controlling the upper disc or the lower disc to be fed transversely, and turning a corresponding grinding groove via the turning tools; third step, removing the turning tools and washing the surface of the corresponding discs.