Invention Grant
- Patent Title: Method for manufacturing three-dimensional structure, three-dimensional structure manufacturing apparatus, ink set, and three-dimensional structure
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Application No.: US15111784Application Date: 2015-01-14
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Publication No.: US10220570B2Publication Date: 2019-03-05
- Inventor: Eiji Okamoto
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2014-005447 20140115
- International Application: PCT/JP2015/000142 WO 20150114
- International Announcement: WO2015/107890 WO 20150723
- Main IPC: B29C64/40
- IPC: B29C64/40 ; B33Y80/00 ; B33Y70/00 ; B33Y10/00 ; B33Y30/00 ; C09D5/00 ; C09D11/107 ; B29C64/112 ; B29C64/129 ; B29K105/00

Abstract:
In the method for manufacturing a three-dimensional structure of the invention, an ink for forming an entity portion is applied to a region where the three-dimensional structure is configured, and an ink for forming a sacrificial layer is applied to a region on a surface side of an outermost layer which is adjacent to a region to become the outermost. As the ink for forming a sacrificial layer, a first ink for forming a sacrificial layer and a second ink for forming a sacrificial layer are used. At the time of curing the ink for forming an entity portion, the viscoelasticity of the first ink is smaller than that of the ink for forming an entity portion, and at the time of curing the ink for forming an entity portion, the viscoelasticity of the second ink is greater than that of the ink for forming an entity portion.
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