Invention Grant
- Patent Title: Packing of polycrystalline silicon
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Application No.: US13861969Application Date: 2013-04-12
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Publication No.: US10221002B2Publication Date: 2019-03-05
- Inventor: Joachim Mattes , Bruno Lichtenegger , Matthias Vietz
- Applicant: Joachim Mattes , Bruno Lichtenegger , Matthias Vietz
- Applicant Address: DE Munich
- Assignee: Wacker Chemie AG
- Current Assignee: Wacker Chemie AG
- Current Assignee Address: DE Munich
- Agency: Caesar Rivise, PC
- Priority: DE102012206251 20120417
- Main IPC: B65D81/02
- IPC: B65D81/02 ; B65D81/00 ; B32B9/04 ; B65D75/38 ; B65D77/02 ; B65D81/05

Abstract:
A method for packing polycrystalline silicon in the form of fragments or round rods, wherein at least one film in each case is inserted into a cuboidal cardboard box matched to the dimensions of the polycrystalline silicon to be packed, the polycrystalline silicon is introduced into the at least one film, the at least one film of thickness 10 to 1000 μm subsequently being welded and enclosing the polycrystalline silicon, and this at least one film being surrounded by a further film having a reinforcing structure or by a shaping element.
Public/Granted literature
- US20130269295A1 PACKING OF POLYCRYSTALLINE SILICON Public/Granted day:2013-10-17
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