Invention Grant
- Patent Title: Laser drilling method and laser drilling system
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Application No.: US14437027Application Date: 2014-09-30
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Publication No.: US10221086B2Publication Date: 2019-03-05
- Inventor: Dai Dong , Weigang Gong , Yang Huang , Sheng Tao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN CN
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN CN
- Agency: Brooks Kushman P.C.
- Priority: CN201410013225 20140110; CN201410058041 20140220
- International Application: PCT/CN2014/087917 WO 20140930
- International Announcement: WO2015/103893 WO 20150716
- Main IPC: C03B33/09
- IPC: C03B33/09 ; C03B33/02 ; B23K26/03 ; B23K26/142 ; B23K26/388 ; B23K26/70 ; C03B33/04 ; B23K26/382 ; B23K26/40 ; B23K26/402 ; B23K26/0622 ; B23K103/00

Abstract:
The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO2 laser beam, aligning the CO2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.
Public/Granted literature
- US20160304386A1 LASER DRILLING METHOD AND LASER DRILLING SYSTEM Public/Granted day:2016-10-20
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