Invention Grant
- Patent Title: Self-healing epoxy resin composition
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Application No.: US15025215Application Date: 2014-09-26
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Publication No.: US10221276B2Publication Date: 2019-03-05
- Inventor: Pradip Kumar Dubey , Amit Dixit , Pankaj Verma
- Applicant: ADITYA BIRLA CHEMICALS (THAILAND) LTD.
- Applicant Address: TH A. Muangrayong
- Assignee: Aditya Birla Chemicals (Thailand) Ltd.
- Current Assignee: Aditya Birla Chemicals (Thailand) Ltd.
- Current Assignee Address: TH A. Muangrayong
- Agency: Klarquist Sparkman, LLP
- Priority: IN2875/DEL/2013 20130927
- International Application: PCT/IB2014/001928 WO 20140926
- International Announcement: WO2015/044757 WO 20150402
- Main IPC: C08G59/40
- IPC: C08G59/40 ; C08L63/00 ; C08K3/36 ; C08G77/388

Abstract:
A self-healing hydrophobic epoxy resin composition is provided. The self-healing epoxy resin composition comprises an epoxy resin component and a hardener component, the hardener component comprises at least 0.1 weight % of a modified epoxy resin hardener. The modified epoxy resin hardener is a reaction product of an amino modified oligomericsiloxane and a carboxylic acid anhydride. A process for preparing the modified epoxy resin hardener is also disclosed.
Public/Granted literature
- US20160229950A1 SELF-HEALING EPOXY RESIN COMPOSITION Public/Granted day:2016-08-11
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