Invention Grant
- Patent Title: Resin composition and resin molded article
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Application No.: US15662942Application Date: 2017-07-28
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Publication No.: US10221287B2Publication Date: 2019-03-05
- Inventor: Tsuyoshi Miyamoto , Daisuke Nakayama , Masayuki Okoshi , Hiroyuki Moriya
- Applicant: FUJI XEROX CO., LTD.
- Applicant Address: JP Minato-Ku, Tokyo
- Assignee: FUJI XEROX CO., LTD.
- Current Assignee: FUJI XEROX CO., LTD.
- Current Assignee Address: JP Minato-Ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2016-250520 20161226
- Main IPC: C08L23/12
- IPC: C08L23/12 ; C08L23/26 ; C08K7/06 ; C08L77/02 ; C08J5/04
Abstract:
A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the resin containing at least one of an amide bond and an imide bond and the thermoplastic resin is 90° C. or lower, and a compatibilizer.
Public/Granted literature
- US20180179346A1 RESIN COMPOSITION AND RESIN MOLDED ARTICLE Public/Granted day:2018-06-28
Information query
