There is provided a method of bonding a first substrate to a second substrate, wherein said method comprises (a) applying a layer of a waterborne adhesive composition to a surface of said first substrate, wherein said waterborne adhesive composition comprises one or more vinyl polymer that comprises (i) 0 to 0.4% polymerized units of carboxyl functional monomer, by weight based on the weight of said vinyl polymer, and (ii) 0.1% to 10% polymerized units of amide monomer, by weight based on the weight of said vinyl polymer, (b) drying said layer of a waterborne adhesive composition to remove water, and (b) contacting a surface of said second substrate to said layer, wherein one or both of said first substrate and said second substrate comprises one or more slip agent Also provided is a bonded article made by such a method.