Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15255565Application Date: 2016-09-02
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Publication No.: US10221480B2Publication Date: 2019-03-05
- Inventor: Hitoshi Kato , Yukio Ohizumi , Manabu Honma
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2015-176692 20150908
- Main IPC: C23C16/44
- IPC: C23C16/44 ; H01L21/67 ; C23C16/455 ; C23C16/458 ; H01L21/687 ; C23C16/40 ; H01L21/02

Abstract:
There is provided a substrate processing apparatus for processing a substrate by supplying a processing gas to the substrate while revolving the substrate, the substrate processing apparatus including: a rotary table installed within a processing container; a rotating mechanism configured to rotate the rotary table; a support part installed in a rotary shaft of the rotary table below the rotary table; an opening portion formed in the rotary table to correspond to a mounting position where the substrate is mounted; a mounting part rotatably supported by the support part through the opening portion, and configured to mount the substrate thereon such that a height level of an upper surface of the substrate coincides with a height level of an upper surface of the rotary table; and a rotating mechanism configured to rotate the mounting part.
Public/Granted literature
- US20170067160A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2017-03-09
Information query
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