A module comprising an electronic component and an electrical connector that are interconnected by a printed circuit board that is fastened to a heat sink, the connector includes a housing, connection contacts and a bundle of wires, which are secured to the housing and respectively interconnected electrically. The housing is arranged on one side of the board such that the contacts pass through the board so as to emerge onto the other side and to be connected electrically there. The board is fastened to the heat sink by the side thereof bearing the contacts. The surface of the heat sink receives the board having a boss at least level with the contacts, so as to avoid electrical contact between the contacts and the heat sink.