Invention Grant
- Patent Title: Three dimensional structure fabrication control using novel processing system
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Application No.: US15605869Application Date: 2017-05-25
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Publication No.: US10222202B2Publication Date: 2019-03-05
- Inventor: Morgan D. Evans , Simon Ruffell , Tristan Y. Ma , Kevin Anglin
- Applicant: Varian Semiconductor Equipment Associates, Inc.
- Applicant Address: US MA Gloucester
- Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- Current Assignee: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- Current Assignee Address: US MA Gloucester
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G01B11/24

Abstract:
An apparatus may include a processor and memory unit, including a control routine having a measurement processor to determine, based upon a first set of scatterometry measurements, a first change in a first dimension of a first set of substrate features along a first direction. The first set of substrate features may be elongated along a second direction perpendicular to the first direction. The measurement processor may be to determine, based upon a second set of scatterometry measurements, a second change in dimension of a second set of substrate features along the second direction, wherein the second set of substrate features is elongated along the first direction. The apparatus may include a control processor to generate an error signal when a figure of merit based upon the first change and the second change lies outside a target range.
Public/Granted literature
- US20180340769A1 THREE DIMENSIONAL STRUCTURE FABRICATION CONTROL USING NOVEL PROCESSING SYSTEM Public/Granted day:2018-11-29
Information query
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