Invention Grant
- Patent Title: Systems and methods to cool mobile device using thermoelectric cooler
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Application No.: US14963846Application Date: 2015-12-09
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Publication No.: US10222829B2Publication Date: 2019-03-05
- Inventor: Song Wang , Jian Li , Jason Matteson , Ming Qian , Jianbang Zhang
- Applicant: LENOVO (SINGAPORE) PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agent John L. Rogitz; John M. Rogitz
- Main IPC: H02J7/02
- IPC: H02J7/02 ; G06F1/16 ; G06F1/20
Abstract:
In one aspect, a device includes a processor and storage accessible to the processor. The storage bears instructions executable by the processor to determine that a trigger regarding an apparatus has been satisfied and, in response to the determination, activate a thermoelectric cooling element (TCE) accessible to the processor.
Public/Granted literature
- US20170172009A1 SYSTEMS AND METHODS TO COOL MOBILE DEVICE USING THERMOELECTRIC COOLER Public/Granted day:2017-06-15
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