Invention Grant
- Patent Title: Pattern evaluation device and visual inspection device comprising pattern evaluation device
-
Application No.: US14761154Application Date: 2014-01-27
-
Publication No.: US10223784B2Publication Date: 2019-03-05
- Inventor: Hiroyuki Ushiba , Tsuyoshi Minakawa
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2013-013826 20130129
- International Application: PCT/JP2014/051661 WO 20140127
- International Announcement: WO2014/119509 WO 20140807
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G01N21/956 ; G01N21/88 ; G01N21/95 ; G06K9/00 ; H01L21/033 ; H01L21/66
Abstract:
A pattern evaluation device of the present invention includes a model estimation unit that estimates a model caused by a manufacturing method on the basis of an inspection image, a deformation amount estimation unit that estimates a deformation amount of the inspection image by using the estimated model, a reference data deformation unit that deforms reference data by using the estimated deformation amount, and an evaluation unit that performs an evaluation process by comparing the reference data which is deformed by the reference data deformation unit with the inspection image.
Public/Granted literature
- US20160063690A1 Pattern Evaluation Device and Visual Inspection Device Comprising Pattern Evaluation Device Public/Granted day:2016-03-03
Information query
