Invention Grant
- Patent Title: Electrode structure and the corresponding electrical component using the same and the fabrication method thereof
-
Application No.: US15796870Application Date: 2017-10-30
-
Publication No.: US10224138B2Publication Date: 2019-03-05
- Inventor: Chi-Hsun Lee , Hsieh-Shen Hsieh , Sen-Huei Chen
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD.
- Current Assignee: CYNTEC CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/04 ; H01L23/00 ; H01F27/02 ; H01F27/29 ; H01L49/02 ; H01F3/10

Abstract:
An electrical component is disclosed, wherein the electrical component comprises: a body; a conductive element disposed in the body; a first metal layer, disposed on the body and electrically connected to a terminal of the conductive element; a conductive and adhesive layer, overlaying on the first metal layer; and a second metal layer, overlaying on the first metal layer and the conductive and adhesive layer, wherein a first conductive path is formed from the terminal of the conductive element to the second metal layer via the first metal layer and the conductive and adhesive layer, and a second conductive path is formed from the terminal of the conductive element to the second metal layer via the first metal layer without passing through the conductive and adhesive layer.
Public/Granted literature
Information query