Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15388311Application Date: 2016-12-22
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Publication No.: US10224198B2Publication Date: 2019-03-05
- Inventor: Tetsuya Emoto , Atsuro Eitoku , Tomomi Iwata
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2015-255046 20151225
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; H01L21/687
Abstract:
A low surface tension liquid is supplied from a low surface tension liquid supplying unit to a heated substrate to replace a processing liquid by the low surface tension liquid. The heating of the substrate is weakened and the low surface tension liquid is supplied from the low surface tension liquid supplying unit to the substrate, so that a liquid film of the low surface tension liquid is formed. The liquid film on the substrate is removed by strengthening the heating of the substrate without supplying the low surface tension liquid from the low surface tension liquid supplying unit to a central region of the substrate.
Public/Granted literature
- US20170182515A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2017-06-29
Information query
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