Invention Grant
- Patent Title: Plating method and recording medium
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Application No.: US15150517Application Date: 2016-05-10
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Publication No.: US10224208B2Publication Date: 2019-03-05
- Inventor: Nobutaka Mizutani , Mitsuaki Iwashita , Takashi Tanaka
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2015-096756 20150511
- Main IPC: C23C18/16
- IPC: C23C18/16 ; C23C18/18 ; C23C18/32 ; C23C18/38 ; C23C18/50 ; C23C18/54 ; H01L23/48 ; H01L21/288 ; H01L21/768 ; H01L23/532

Abstract:
An electroless plating process is performed on an Al layer, which is made of aluminum or an aluminum alloy, with an electroless plating liquid which is alkaline and contains a complexing agent. A plating method includes preparing a substrate 10 having a surface (for example, bottom surface of TSV 12) at which an Al layer 22 made of aluminum or an aluminum alloy is exposed; forming a zincate film 30 on a surface of the Al layer by performing a zincate treatment on the substrate; and forming a first electroless plating layer (for example, Co barrier layer 14a) on the surface of the Al layer with an electroless plating liquid (for example, Co-based plating liquid) which is alkaline and contains a complexing agent.
Public/Granted literature
- US20160336179A1 PLATING METHOD AND RECORDING MEDIUM Public/Granted day:2016-11-17
Information query
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