Invention Grant
- Patent Title: Electrostatic chucks and substrate processing apparatus including the same
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Application No.: US15420211Application Date: 2017-01-31
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Publication No.: US10224228B2Publication Date: 2019-03-05
- Inventor: Minsung Kim , Myoung Soo Park , Dougyong Sung , Yun-Kwang Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0031014 20160315
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01J37/32 ; C23C16/44 ; H01L21/683
Abstract:
A substrate processing apparatus includes an electrostatic chuck which is made up of a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a first heater section in the dielectric plate between the chuck electrode and the base. The first heater section includes first heaters that are separated from each other in a first direction, and respective first upper plate electrodes disposed between the first heaters and the base. The first upper plate electrodes are separated from each other in the first direction and respectively connected to the first heaters.
Public/Granted literature
- US20170271190A1 ELECTROSTATIC CHUCKS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME Public/Granted day:2017-09-21
Information query
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