Invention Grant
- Patent Title: Element place on laminates
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Application No.: US14973158Application Date: 2015-12-17
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Publication No.: US10224269B2Publication Date: 2019-03-05
- Inventor: Charles L. Arvin , Brian M. Erwin , Brian W. Quinlan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Jennifer Anda
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/31
Abstract:
A module includes a laminate, the laminate including a solder mask layer and at least one depression in an upper surface of the solder mask layer that does not pass all of the way through the solder mask layer. The module also includes a first electronic element disposed in a first of the at least one depressions.
Public/Granted literature
- US20170179015A1 ELEMENT PLACE ON LAMINATES Public/Granted day:2017-06-22
Information query
IPC分类:
