Invention Grant
- Patent Title: Assembling method, manufacturing method, device and electronic apparatus of flip-die
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Application No.: US15531243Application Date: 2015-07-14
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Publication No.: US10224307B2Publication Date: 2019-03-05
- Inventor: Quanbo Zou , Zhe Wang
- Applicant: Goertek, Inc.
- Applicant Address: CN Weifang, Shandong
- Assignee: GOERTEK, INC.
- Current Assignee: GOERTEK, INC.
- Current Assignee Address: CN Weifang, Shandong
- Agency: Hultquist, PLLC
- Agent Steven J. Hultquist
- International Application: PCT/CN2015/083983 WO 20150714
- International Announcement: WO2017/008251 WO 20170119
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/00 ; H01L21/50 ; H01L21/66 ; H01L25/075 ; H01L21/683
Abstract:
The present invention discloses a assembling method, a manufacturing method, an device and an electronic apparatus of flip-die. The method for assembling a flip-die, comprises: temporarily bonding the flip-die onto a laser-transparent first substrate, wherein bumps of the flip-die are located on the side of the flip-die opposite to the first substrate; aligning the bumps with pads on a receiving substrate; irradiating the original substrate with laser from the first substrate side to lift-off the flip-die from the first substrate; and attaching the flip-die on the receiving substrate. A faster assembly rate can be achieved by using the present invention. A smaller chip size can be achieved by using the present invention. A lower profile can be achieved by using the present invention.
Public/Granted literature
- US20170330856A1 ASSEMBLING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF FLIP-DIE Public/Granted day:2017-11-16
Information query
IPC分类:
