Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15578318Application Date: 2016-07-22
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Publication No.: US10224322B2Publication Date: 2019-03-05
- Inventor: Weitao Cheng , Shigeki Takahashi , Masakiyo Sumitomo
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2015-174091 20150903
- International Application: PCT/JP2016/071518 WO 20160722
- International Announcement: WO2017/038296 WO 20170309
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/8234 ; H01L29/739 ; H01L27/04 ; H01L27/088 ; H01L29/06 ; H01L29/10 ; H01L29/423 ; H01L29/861 ; H01L29/40

Abstract:
A semiconductor device includes a diode provided with: a drift layer being a first conductivity type; a cathode region being provided in a back face side of the drift layer and being the first conductivity type; a second conductivity type region provided in a surface layer part of the drift layer; multiple trenches dividing the second conductivity type region into pieces by being provided deeper than the second conductivity type region, and configuring an anode region; a gate insulation film provided in a surface of the trench; a gate electrode provided in a surface of the gate insulation film; an upper electrode electrically connected with the anode region; and a lower electrode electrically connected with the cathode region. A width between the trenches is narrowest in the drift layer is defined as a mesa width. The mesa width is set to be equal to or greater than 0.3 μm.
Public/Granted literature
- US20180151558A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-05-31
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