Invention Grant
- Patent Title: Embedded passive chip device and method of making the same
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Application No.: US15723111Application Date: 2017-10-02
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Publication No.: US10224389B2Publication Date: 2019-03-05
- Inventor: Min-Ho Hsiao , Pang-Yen Lee , Yen-Hao Tseng
- Applicant: Wafer Mems Co., Ltd.
- Applicant Address: TW Jhunan Township
- Assignee: WAFER MEMS CO., LTD.
- Current Assignee: WAFER MEMS CO., LTD.
- Current Assignee Address: TW Jhunan Township
- Agency: Womble Bond Dickinson (US) LLP
- Priority: TW104120532A 20150625
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L21/768 ; H01L21/78 ; H01F41/04 ; H01L23/64 ; H01F17/00
Abstract:
An embedded passive chip device includes a chip body and a functional layered structure. The chip body has a circuit-forming surface that is formed with a recess. The functional layered structure is formed on the chip body and includes a conductive layer that has at least a portion which covers at least partially the circuit-forming surface, and a magnetic layer that is disposed within the recess and that is inductively coupled to the conductive layer for generating inductance. A method of making the embedded passive chip device is also disclosed.
Public/Granted literature
- US20180026090A1 Embedded Passive Chip Device and Method of Making the Same Public/Granted day:2018-01-25
Information query
IPC分类:
