A thermoelectric power module which can be manufactured without spoiling solderability or joining strength when a thermoelectric element and an electrode are joined to each other by using solder, and in which electric resistance does not largely increase in long time use. The thermoelectric power module includes: a thermoelectric element consisting essentially of a thermoelectric material containing at least two kinds of elements of bismuth, tellurium, antimony, and selenium as principal components; at least one diffusion prevention layer and a solder joint layer disposed in sequence on a surface of the thermoelectric element, the at least one diffusion prevention layer not containing nickel, and the solder joint layer consisting essentially of at least one of nickel, tin, and an alloy or compound containing them as principal components; an electrode; an electrode protection layer disposed at least on one principal surface of the electrode, and including a film containing nickel as a principal component and having a thickness of 0.2 μm to 3.0 μm; and a solder layer joining the solder joint layer to a partial area of the electrode protection layer.