A high frequency connector is disclosed. The high frequency connector includes an insulating housing, a plurality of insulating pieces, and a plurality of terminals. Each of the terminals is respectively assembled to the insulating pieces. The plurality of insulating pieces are assembled to the insulating housing. Each of the insulating pieces has a first surface and a second surface. A plurality of recesses are formed on each of the first surface and the second surface. The recesses are arranged in parallel on each of the first surface and the second surface. A plurality of impedance adjustment holes are arranged on each of the first surface and the second surface in an interlaced manner. The impedance adjustment holes are disposed between the recesses. Each of the terminals is received in the impedance adjustment hole or the recess, so as to improve characteristic impedances and crosstalk interferences of the terminals.