Invention Grant
- Patent Title: Heat-recoverable component, electrical wire bundle, and insulated electrical wire-covering method
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Application No.: US15573534Application Date: 2017-01-10
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Publication No.: US10224705B2Publication Date: 2019-03-05
- Inventor: Ryota Fukumoto , Satoshi Yamasaki , Shinya Nishikawa , Yuuki Yabe
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC FINE POLYMER, INC.
- Applicant Address: JP Osaka-shi, Osaka JP Sennan-gun, Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.,SUMITOMO ELECTRIC FINE POLYMER, INC.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.,SUMITOMO ELECTRIC FINE POLYMER, INC.
- Current Assignee Address: JP Osaka-shi, Osaka JP Sennan-gun, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2016-005637 20160114
- International Application: PCT/JP2017/000374 WO 20170110
- International Announcement: WO2017/122601 WO 20170720
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H02G15/04 ; B32B7/02 ; B32B1/08 ; H01B7/282 ; H01R4/02 ; H01R4/72 ; H01B13/32 ; H01R4/22 ; H02G15/18

Abstract:
A heat-recoverable component includes a tube-shaped or cap-shaped base material layer having heat shrinkability, and an adhesive layer formed on an inner circumferential surface of the base material layer. The adhesive layer includes a low-viscosity adhesive portion and a high-viscosity adhesive portion disposed between the low-viscosity adhesive portion and an opening of the base material layer. The low-viscosity adhesive portion has a shear viscosity of 10 Pa·s or less at a shear rate of 1 s−1 at a heat shrinkage temperature of the base material layer. The high-viscosity adhesive portion has a shear viscosity of 100 Pa·s or more at a shear rate of 1 s−1 at the heat shrinkage temperature of the base material layer. At the heat shrinkage temperature, a ratio of the shear viscosity of the high-viscosity adhesive portion to the shear viscosity of the low-viscosity adhesive portion is 15,000 or less.
Public/Granted literature
- US10263410B2 Heat-recoverable component, electrical wire bundle, and insulated electrical wire-covering method Public/Granted day:2019-04-16
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