Invention Grant
- Patent Title: Electronic component fuse and fused electronic component module
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Application No.: US15497017Application Date: 2017-04-25
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Publication No.: US10224707B2Publication Date: 2019-03-05
- Inventor: Yousuke Nakada , Kenji Matsumoto , Tetsuo Shimura , Kazuya Sato
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD
- Current Assignee: TAIYO YUDEN CO., LTD
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2016-089795 20160427
- Main IPC: H02H3/08
- IPC: H02H3/08 ; G05B9/02 ; H01G9/00 ; H01H85/055 ; H02H1/00 ; H01G4/40 ; H01G2/16 ; H01G4/30

Abstract:
In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.
Public/Granted literature
- US20170317484A1 ELECTRONIC COMPONENT FUSE AND FUSED ELECTRONIC COMPONENT MODULE Public/Granted day:2017-11-02
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