Invention Grant
- Patent Title: Pressure sensing implant
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Application No.: US14777654Application Date: 2014-03-17
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Publication No.: US10226218B2Publication Date: 2019-03-12
- Inventor: Harry Rowland , Michael Nagy , Balamurugan Sundaram , Suresh Sundaram
- Applicant: ENDOTRONIX, INC.
- Applicant Address: US IL Woodridge
- Assignee: ENDOTRONIX, INC.
- Current Assignee: ENDOTRONIX, INC.
- Current Assignee Address: US IL Woodridge
- Agency: McDonald Hopkins LLC
- International Application: PCT/US2014/030661 WO 20140317
- International Announcement: WO2014/197101 WO 20141211
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A61B5/0215 ; A61B5/07

Abstract:
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
Public/Granted literature
- US20160029956A1 PRESSURE SENSING IMPLANT Public/Granted day:2016-02-04
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