A robotic placement machine including a base operably connected to the Y axis actuator and the X axis actuator, a first Z axis actuator coupled to the first end of the base, the first Z axis actuator capable of moving up and down a first Z axis, a second Z axis actuator coupled to the second end of the base, the second Z axis actuator capable of moving up and down a second Z axis, and a pick and place plate operably connected to the first Z axis actuator and the second Z axis actuator, wherein the first Z axis actuator and the second Z axis actuator are each capable of moving independently of each other to tilt the pick and place plate is provided. Furthermore, a system comprising a first machine, second machine, and third machine to eliminate air bubbles when bonding two substrates is also provided. A method of optical bonding is further provided.