Invention Grant
- Patent Title: Plasma processing apparatus
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Application No.: US13661118Application Date: 2012-10-26
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Publication No.: US10229814B2Publication Date: 2019-03-12
- Inventor: Tomohiro Okumura , Hiroshi Kawaura , Tetsuya Yukimoto
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Panasonic IP Management
- Priority: JP2011-235766 20111027; JP2011-266589 20111206; JP2011-267960 20111207; JP2011-267961 20111207
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H05H1/30 ; H01L21/3065
Abstract:
A plasma processing apparatus has a circular chamber having an opening portion which serves as a plasma ejection port surrounded by a dielectric member, a gas supply pipe for introducing gas into the inside of the chamber, a coil provided in the vicinity of the chamber, a high-frequency power supply connected to the coil, and a base material mounting table.
Public/Granted literature
- US20130115780A1 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD Public/Granted day:2013-05-09
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