- Patent Title: Method for manufacturing silicon carbide epitaxial substrate, silicon carbide epitaxial substrate, method for manufacturing silicon carbide semiconductor device, and silicon carbide semiconductor device
-
Application No.: US15567443Application Date: 2016-04-06
-
Publication No.: US10229836B2Publication Date: 2019-03-12
- Inventor: Keiji Wada , Taro Nishiguchi , Toru Hiyoshi
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Laura G. Remus
- Priority: JP2015-101018 20150518
- International Application: PCT/JP2016/061212 WO 20160406
- International Announcement: WO2016/185819 WO 20161124
- Main IPC: C23C16/32
- IPC: C23C16/32 ; C30B29/36 ; H01L29/16 ; H01L21/306 ; C30B25/20 ; H01L21/02 ; H01L29/34 ; H01L29/40 ; H01L29/78 ; C23C16/56 ; H01L29/66 ; H01L29/739 ; H01L29/04 ; C30B25/02

Abstract:
A method for manufacturing a silicon carbide epitaxial substrate includes epitaxially growing a first layer on a silicon carbide single crystal substrate, and forming a second layer at an outermost surface of the first layer. The second layer has a chemical composition or density different from that of the first layer. A ratio of a thickness of the second layer to a thickness of the first layer is more than 0% and less than or equal to 10%.
Public/Granted literature
Information query
IPC分类: