Invention Grant
- Patent Title: Substrate processing apparatus and control device for substrate processing apparatus
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Application No.: US14439039Application Date: 2013-10-30
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Publication No.: US10229843B2Publication Date: 2019-03-12
- Inventor: Hiroichi Ohta , Kozo Minami
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2012-239972 20121031
- International Application: PCT/JP2013/006438 WO 20131030
- International Announcement: WO2014/068981 WO 20140508
- Main IPC: C23C16/52
- IPC: C23C16/52 ; H01L21/67 ; H01L31/18 ; H01L21/66

Abstract:
Provided is a substrate processing apparatus including: a substrate processing unit configured to accommodate a substrate in a processing chamber, and process the substrate; and a control unit including a storage unit, a main storage unit, and a user interface unit. The control unit includes: recipe optimizing means configured to calculate a difference between measurement data obtained by measuring a processing result of the substrate and a target value, and optimize a recipe by changing some of processing conditions of the recipe so that the difference becomes smaller, and recipe batch-optimizing means configured to retrieve a batch-optimizable recipe in the storage unit in connection with the recipe and change some of processing conditions on the retrieved recipe like the recipe, on which the optimization is being performed.
Public/Granted literature
- US20150294884A1 SUBSTRATE PROCESSING APPARATUS AND CONTROL DEVICE FOR SUBSTRATE PROCESSING APPARATUS Public/Granted day:2015-10-15
Information query
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