Invention Grant
- Patent Title: Method of making a wire support leadframe for a semiconductor device
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Application No.: US15896971Application Date: 2018-02-14
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Publication No.: US10229868B2Publication Date: 2019-03-12
- Inventor: Yuh-Harng Chien , Chih-Chien Ho , Steven Su
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agency: Rose Alyssa Keagy
- Agent Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/498 ; H01L23/00 ; H01L25/065 ; H01L25/18 ; H01L21/56
Abstract:
A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.
Public/Granted literature
- US20180174950A1 Method Of Making A Wire Support Leadframe For A Semiconductor Device Public/Granted day:2018-06-21
Information query
IPC分类:
