Invention Grant
- Patent Title: Discrete component backward traceability and semiconductor device forward traceability
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Application No.: US15053575Application Date: 2016-02-25
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Publication No.: US10229886B2Publication Date: 2019-03-12
- Inventor: Cheeman Yu , Didier Chavet
- Applicant: SanDisk Semiconductor (Shanghai) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
- Current Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/67 ; H01L21/66

Abstract:
A system is disclosed for providing backward and forward traceability by a methodology which identifies discrete components (die, substrate and/or passives) that are included in a semiconductor device. The present technology further includes a system for generating a unique identifier and marking a semiconductor device with the unique identifier enabling the semiconductor device, and the discrete components within that device, to be tracked and traced through each process and test in the production of the semiconductor device.
Public/Granted literature
- US20160181205A1 DISCRETE COMPONENT BACKWARD TRACEABILITY AND SEMICONDUCTOR DEVICE FORWARD TRACEABILITY Public/Granted day:2016-06-23
Information query
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