Invention Grant
- Patent Title: Semiconductor device and power conversion device
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Application No.: US15560428Application Date: 2015-05-18
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Publication No.: US10229974B2Publication Date: 2019-03-12
- Inventor: Mieko Matsumura , Junichi Sakano , Naoki Tega , Yuki Mori , Haruka Shimizu , Keisuke Kobayashi
- Applicant: HITACHI, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- International Application: PCT/JP2015/064222 WO 20150518
- International Announcement: WO2016/185544 WO 20161124
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/73 ; H01L29/739 ; H01L29/06 ; H01L29/08 ; H01L29/36 ; H01L29/10 ; H01L29/423 ; H01L29/78 ; H01L29/417

Abstract:
To solve a problem of realizing a large current and highly reliable power semiconductor device while shrinking a unit cell. A semiconductor device according to the present invention includes a plurality of p-type body regions extending in a first direction. The semiconductor device further includes: a JFET region formed to extend in the first direction between p-type body regions which are adjacent to each other in a second direction orthogonal to the first direction; an n+-type source region formed to extend in the first direction within a p-type body region and separate from an end side surface of the p-type body; and a channel region formed to extend in the first direction and in a top layer portion of a p-type body region between an end side surface of the p-type body region and an end side surface of an n+-type source region.
Public/Granted literature
- US20180090574A1 SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE Public/Granted day:2018-03-29
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