Invention Grant
- Patent Title: Compound semiconductor film structure
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Application No.: US15262306Application Date: 2016-09-12
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Publication No.: US10229976B2Publication Date: 2019-03-12
- Inventor: Chung-Chieh Yang
- Applicant: Lextar Electronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: LEXTAR ELECTRONICS CORPORATION
- Current Assignee: LEXTAR ELECTRONICS CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW104134646A 20151022
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/306 ; H01L21/02 ; H01L29/06 ; H01L29/205

Abstract:
A compound semiconductor film structure includes a substrate, a first compound semiconductor epitaxial layer and a second compound semiconductor epitaxial layer. The substrate has a top surface. The first compound semiconductor epitaxial layer is formed on the top surface and has an epitaxial interface and at least one recess, wherein the epitaxial interface is disposed on one side of the first compound semiconductor epitaxial layer opposite to the side of the first compound semiconductor epitaxial layer facing the top surface, and the at least one recess is formed in the first compound semiconductor epitaxial layer. The second compound semiconductor epitaxial layer formed on the epitaxial interface. The top surface and the bottom of recess are separated by a distance substantially ranging between 0.8 μm and 1.3 μm.
Public/Granted literature
- US20170117368A1 COMPOUND SEMICONDUCTOR FILM STRUCTURE Public/Granted day:2017-04-27
Information query
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