An electrical connector for electrically connecting a chip module to a circuit board, includes an insulation body having multiple receiving holes vertically running through the insulation body, multiple terminals respectively accommodated in the receiving holes, and multiple metal members not in contact with the chip module. Each metal member and the corresponding terminal are accommodated in a same receiving hole. Each metal member and the corresponding terminal clamp and fix a solder ball together, so that the solder ball is stably fixed by the terminal, thereby greatly reducing gaps between terminals on a strip, so that the terminals do not need to be designed by skipping gaps. When the terminals are assembled into a same row of receiving holes, the insertion of the terminals into the same row of receiving holes may be completed in one time.