Invention Grant
- Patent Title: Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure
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Application No.: US15936568Application Date: 2018-03-27
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Publication No.: US10232464B2Publication Date: 2019-03-19
- Inventor: Hiroshi Miyashiro , Yoichi Suruga , Shuhei Koyano
- Applicant: NIPPON MEKTRON, LTD.
- Applicant Address: JP Tokyo
- Assignee: NIPPON MEKTRON, LTD.
- Current Assignee: NIPPON MEKTRON, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2017-156753 20170815
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/10 ; B29C65/00 ; B29C65/08
Abstract:
An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
Public/Granted literature
- US20190054562A1 ULTRASONIC BONDING JIG, ULTRASONIC BONDING METHOD, AND BONDING STRUCTURE Public/Granted day:2019-02-21
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