Invention Grant
- Patent Title: Printhead with bond pad surrounded by dam
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Application No.: US15883316Application Date: 2018-01-30
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Publication No.: US10232619B2Publication Date: 2019-03-19
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Devin A. Mourey
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/045 ; B41J2/16

Abstract:
In an embodiment, a printhead includes a fluidic die molded into a moldable material. The die has a front surface exposed outside the moldable material to dispense fluid and an opposing back surface covered by the moldable material except at a channel in the moldable material through which fluid may pass directly to the back surface. The die has a first bond pad on the front surface surrounded by a first dam to prevent the moldable material from contacting the first bond pad.
Public/Granted literature
- US20180154632A1 PRINTHEAD WITH BOND PAD SURROUNDED BY DAM Public/Granted day:2018-06-07
Information query
IPC分类: