Invention Grant
- Patent Title: Phosphazene compound, and a composition, a prepreg and a wiring board comprising the same
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Application No.: US15234014Application Date: 2016-08-11
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Publication No.: US10233204B2Publication Date: 2019-03-19
- Inventor: Qingchong Pan
- Applicant: Guangdong Guangshan New Materials Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: GUANGDONG GUANGSHAN NEW MATERIALS CO., LTD.
- Current Assignee: GUANGDONG GUANGSHAN NEW MATERIALS CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: McDonald Hopkins LLC
- Priority: CN201511025327 20151229
- Main IPC: C07F9/659
- IPC: C07F9/659 ; C08J7/00 ; C09K21/12 ; C07F9/6593 ; C08K5/5399 ; C08J5/24

Abstract:
The present invention relates to a phosphazene compound and a composite metal laminate. The phosphazene compound with a partial structure of carboxylic esters has a structure as shown in Formula (I). The present invention obtains a phosphazene compound with a partial structure of carboxylic esters using an M group having specific components. The cured products of the phosphazene compound have good flame retardancy, heat resistance, mechanical properties, flame retardancy, and low dielectric constant, and are a low dielectric flame retardant material having great economic properties and being environmental friendly.
Public/Granted literature
- US20170183366A1 PHOSPHAZENE COMPOUND, AND A COMPOSITION, A PREPREG AND A WIRING BOARD COMPRISING THE SAME Public/Granted day:2017-06-29
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