Invention Grant
- Patent Title: Road geometry matching with componentized junction models
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Application No.: US15088317Application Date: 2016-04-01
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Publication No.: US10234294B2Publication Date: 2019-03-19
- Inventor: Robin Kim , Maro{hacek over (s)} Budaj
- Applicant: HERE Global B.V.
- Applicant Address: NL Eindhoven
- Assignee: HERE Global B.V.
- Current Assignee: HERE Global B.V.
- Current Assignee Address: NL Eindhoven
- Agency: Lempia Summerfield Katz LLC
- Main IPC: G01C21/30
- IPC: G01C21/30 ; G01C21/32 ; G01C21/36

Abstract:
In one embodiment, a method for road geometry matching with componentized junction models is provided. The method includes receiving a plurality of predefined road component models, receiving map data representing a physical road junction, selecting a subset of the plurality of road component models to characterize the physical road junction represented by the received map data, and defining a road junction configuration for the physical road junction with the selected road component models.
Public/Granted literature
- US20170284812A1 Road Geometry Matching with Componentized Junction Models Public/Granted day:2017-10-05
Information query
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