Invention Grant
- Patent Title: Dissipating heat within housings for electrical components
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Application No.: US15206826Application Date: 2016-07-11
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Publication No.: US10234916B2Publication Date: 2019-03-19
- Inventor: Lee Warren Atkinson
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20

Abstract:
In some examples, an apparatus includes a housing comprising an inner surface provided with thermal members, and a thermal attachment to transfer heat generated by a heat producing component to the housing. The thermal attachment is thermally contacted with the inner surface of the housing, and the thermal members are arranged to steer heat from the heat producing component and transferred to the housing by the thermal attachment at a greater heat flow rate through the housing to a first region of the housing and at a lesser heat flow rate through the housing to a second region of the housing.
Public/Granted literature
- US20160320815A1 DISSIPATING HEAT WITHIN HOUSINGS FOR ELECTRICAL COMPONENTS Public/Granted day:2016-11-03
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