Invention Grant
- Patent Title: Wire harness and manufacturing method of wire harness
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Application No.: US15826518Application Date: 2017-11-29
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Publication No.: US10236096B2Publication Date: 2019-03-19
- Inventor: Hiroyuki Yoshida , Hideomi Adachi , Takeshi Ogue , Masahide Tsuru , Kenta Yanazawa , Toshihiro Nagashima
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2016-232683 20161130
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H01B7/02 ; H01B13/14 ; H01B13/012 ; H02G3/04

Abstract:
A wire harness including one or more electrically conductive paths and a resin molded product having a tubular shape which accommodates and protects the one or more electrically conductive paths. The resin molded product includes a first part having clearances along a circumferential direction between an inner surface of the resin molded product and outer surfaces of the one or more electrically conductive paths and a second part having substantially no clearance between the inner surface of the resin molded product and an outer surface of one of the one or more electrically conductive paths in an area along the circumferential directions.
Public/Granted literature
- US20180151269A1 WIRE HARNESS AND MANUFACTURING METHOD OF WIRE HARNESS Public/Granted day:2018-05-31
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